| 000 | 03135cgm a2200433Ia 4500 | ||
|---|---|---|---|
| 001 | 31624 | ||
| 003 | AE-DuAU | ||
| 005 | 20241122121747.0 | ||
| 007 | vd cvaizz | ||
| 008 | 050222r20041999cau031 vleng d | ||
| 050 | 1 | 4 |
_aTK7874 _b.S5526 2004 |
| 090 | _aDVD TK 7874 .S5526 2004 | ||
| 245 | 0 | 0 |
_aSilicon run lithography _h[videorecording] / _c a film by Ruth A. Carranza [in collaboration with the Stanford Nanofabrication Facility] ; producer/director, Ruth A. Carranza ; writers, Ruth Carranza, John Shott. |
| 246 | 3 | 0 | _aLithography |
| 246 | 3 | _aSilicon run. | |
| 260 |
_aMountain View, CA : _b Ruth Carranza Productions : _b Silicon Run Productions, _c c2004, 1999. |
||
| 300 |
_a1 videodisc (31 min.) : _bsd., col. ; _c4 3/4 in. |
||
| 490 | 1 | _aSilicon Run films series | |
| 538 | _aDVD; NTSC. | ||
| 508 | _aProducer/director Ruth A. Carranza ; writers Ruth Carranza, John Shott ; cinematographer, Wah Ho Chan ; editor, Pam Walton ; narrator, Susan Jerome, music, Neil Panton. | ||
| 500 | _aA presentation of Intel Foundation, Nikon Precision, Shipley, Cymer, Applied Materials, Inc., Semiconductor Equipment and Materials International, Stanford Nanofabrication Facility. | ||
| 520 | _aFeatures an in-depth look at the photolithography process in IC manufacturing, includes wafer preparation, photoresist coating, exposure (using i-line steppers and DUV scanners), wafer developing and inspection. | ||
| 505 | 0 | 0 |
_g1. _tIntroduction -- _g2. _tFabrication overview -- _tIC design -- _tMask design & manufacture -- _tFabrication processes -- _g3. _tPhotolithography station -- _tExposure systems -- _tTrack system -- _tPhotolithography chemicals -- _tPhotoresist manufacture -- _tResist viscosity & tolerances -- _tI-line exposure light source -- _g4. _tTrack system -- _tDehydration bake -- _tWafer prime -- _tResist spread -- _tEdge bead dissolve -- _tSoft bake -- _g5. _tI-line stepper -- _tMask -- _t5:1 image reduction -- _tWafer stage -- _tExposure light path -- _tStep and expose system -- _tWafer develop -- _tWafer rinse and dry -- _tHard bake -- _tWafer inspection -- _g6. _tDUV excimer scanner -- _tCritical dimensions -- _tExposure wave length -- _tStep and scan exposure system -- _tAnti-reflective coat deposition -- _tDUV resist -- _t4:1 image reduction -- _tDUV laser exposure -- _tHard bake -- _tWafer inspection -- _g7. _tEnding and credits. |
| 511 | _aNarrator, Susan Jerome. | ||
| 650 | 0 |
_aPhotolithography. _9183391 |
|
| 650 | 0 |
_aIntegrated circuits _xDesign and construction. _9183392 |
|
| 700 | 1 |
_aCarranza, Ruth A., _d1949- _9169460 |
|
| 700 | 1 |
_aShott, John. _9183393 |
|
| 700 | 1 |
_aJerome, Susan. _9183394 |
|
| 710 | 2 |
_aStanford Nanofabrication Facility. _9183395 |
|
| 710 | 2 |
_aSilicon Run Productions. _9169467 |
|
| 710 | 2 |
_aRuth Carranza Productions. _9183396 |
|
| 710 | 2 |
_aStanford Nanofabrication Facility. _9183395 |
|
| 830 | 0 |
_aSilicon Run series _9183397 |
|
| 907 |
_a31624 _b02-28-11 _c02-28-11 |
||
| 942 |
_cDVD _02 |
||
| 998 |
_amedia _b02-28-11 _cm _dg _e- _feng _gcau _h0 |
||
| 945 |
_g0 _i5047745 _j0 _lmedia _o- _p493.15 _q- _r- _s- _t33 _u2 _v2 _w2 _x0 _yi12274355 _z02-28-11 |
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| 999 |
_c31624 _d31624 |
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